TGKSTIM9K is a black coloured silicone thermal pad, suitable for use as thermal interface material or a heat sink to

TG997 is a soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the

PC98 is a white, highly filled non-silicone system used for thermal dissipation of electronic devices. It has a long shelf

SILCOOL TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs. Its low viscosity allows

GLT-SF2, GLT-SF3 Silicone Free Thermal pad are curing molding materials with carrier of acrylic adhesive and filled with thermal material.

PT-398G7 is a two-component silicone, and the ratio by weight A:B=1:1 is used for potting. This product has great leveling

TIA200R-G is a one component, heat curable silicone adhesive designed for thermally conductive application. TIA200R-G cures quickly upon exposure to

TIA200R is a one component, heat curable silicone adhesive designed for thermally conductive applications. TIA200R cures quickly upon exposure to

3M™ Thermally Conductive Silicone Interface Pad 5549S is a moderately conformable and medium-soft pad with very high thermal conductivity of

TIA222G thermally conductive silicone is a two-component material used for encapsulating, gap filling, and as a thermal path to heat

3M™ Thermally Conductive Silicone Interface Pad 5591 is designed to provide a preferential heat transfer path between heat generating components and

SILCOOL TIA0260 is a one-component silicone adhesive that cures on exposure to atmospheric moisture at room temperatures to form a