TIG210BX is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create

TG-PP-10 is a high-performance silicone putty material which is designed to offer a low cost of ownership approach to thermal

TG4040SA is an ultra-soft, silicone based thermal gap filler which offers low thermal impedance, good surface compliance and a high dielectric

NSP-35 is a one-part, fully cured non-silicone gap filler with has been designed to reduce the time to market and overall

TGKSTIM9K is a black coloured silicone thermal pad, suitable for use as thermal interface material or a heat sink to

TG997 is a soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the

PC98 is a white, highly filled non-silicone system used for thermal dissipation of electronic devices. It has a long shelf

Product DescriptionKey Features Of LiPOLY EPDM20Application Of LiPOLY EPDM20 Product Description LiPOLY EPDM20 is a silicone-free two-part liquid caulking agent

Product DescriptionFeature of LIPOLY EPDM30 Application of LIPOLY EPDM30 Product Description LiPOLY EPDM30 is a silicone-free two-part liquid caulking agent that

Product description:Key Feature of LiPOLY EP770Application of LiPOLY EP770 Product description: LiPOLY EP770 is a silicone-free two-part sealing gap filler

FEATURES AND BENEFITS of JONES 21-430SF Silicone – Free Thermal GreaseAPPLICATIONS of JONES 21-430SF Silicone – Free Thermal Grease JONES