SILCOOL TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs. Its low viscosity allows

GLT-SF2, GLT-SF3 Silicone Free Thermal pad are curing molding materials with carrier of acrylic adhesive and filled with thermal material.

PT-398G7 is a two-component silicone, and the ratio by weight A:B=1:1 is used for potting. This product has great leveling

TIA200R-G is a one component, heat curable silicone adhesive designed for thermally conductive application. TIA200R-G cures quickly upon exposure to

TIA200R is a one component, heat curable silicone adhesive designed for thermally conductive applications. TIA200R cures quickly upon exposure to

3M™ Thermally Conductive Silicone Interface Pad 5549S is a moderately conformable and medium-soft pad with very high thermal conductivity of

TIA222G thermally conductive silicone is a two-component material used for encapsulating, gap filling, and as a thermal path to heat

3M™ Thermally Conductive Silicone Interface Pad 5591 is designed to provide a preferential heat transfer path between heat generating components and

Product IntroductionBECTRON® SK 75L2-30 / SG 79V5-30 FeaturesBECTRON® SK 75L2-30 / SG 79V5-30 Applications Product Introduction BECTRON® SK 75L2-30 /

Product IntroductionBECTRON® SK 75V1-15 / SG 79V1-15 FeaturesBECTRON® SK 75V1-15 / SG 79V1-15 Applications Product Introduction BECTRON® SK 75V1-15 /

Product IntroductionBECTRON® SK 75V1-60 / SG 79V1-60 FeaturesBECTRON® SK 75V1-60 / SG 79V1-60 Applications Product Introduction BECTRON® SK 75V1-60 /

Product IntroductionBECTRON® SK 75V1-75 / SG 79V1-75 FeaturesBECTRON® SK 75V1-75 / SG 79V1-75 Applications Product Introduction BECTRON® SK 75V1-75 /