THERMAL GREASE PT-09B-1000 THERMAL GREASE PT-09C-1000 FEATURES: Good thermal conductivity Easy to assemble High stability APPLICATIONS: Electronic components: IC, CPU,

FEATURES: Good thermal conductivity Easy to assemble High stability APPLICATION: Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply,

TG 937 is a white, highly filled silicone system suitable for screen printing process and thermal dissipation of electronic devices.

TG 837 is a grey, highly filled silicone system suitable for screen printing process and thermal dissipation of electronic devices.

BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a

BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a

BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer

BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer

TIG830SP is a silicone grease that provides high thermal conductivity and low thermal resistance. The worability of TIG830SP makes it

Momentive’s thermally conductive gap fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path.

TGZNSG is a dry to touch thermal interface pad formulated with non-silicone thermal grease. It was developed to offer the

TG-S606P is an ultra high performance silicone grease. It has a thermal conductivity of 8 W/mK, superior wetting characteristics, resulting in