SILCOOL TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs. Its low viscosity allows it conform to intricate shapes, and thus enable the reduction of contact interference. SILCOOL TIA216G potting material quickly cures to a soft rubber, gel consistency with exposure to heat, and retains tacky adhesion on its cured surface.
Key Features
- Good thermal conductivity
- Low viscosity
- Fast cure with exposure to heat
- Room temperature cure capability
- Easy to use 1 : 1 mix ratio by weight and volume
- Repairability
- Non-corrosiveness to metal
- UL 94V-0 Compliance (file number E56745)
Applications:
Materials such as water, sulfur, nitrogen compounds, organic metallic salts, phosphorus compounds, etc. contained in the surface of the substrate can inhibit curing. Pre-testing of a sample patch to determine compatibility is recommended. Stir Parts A and B prior to mixing, as filler sedimentation may occur during storage.
|
UNCURED PROPERTIES |
TIA216G (Part A) |
TIA216G (Part B) |
|
|
Appearance |
Gray |
White |
|
|
Mix ratio by weight |
1 : 1 |
||
|
Viscosity Part A |
Pa•s |
9.5 |
|
|
Viscosity Part B |
Pa•s |
6.6 |
|
|
Viscosity after mixing |
mPa•s |
7.8 |
|
Work life at 23 °C |
Hours |
2 |
|
Cure Time @ RT |
Hours |
6 |
|
Cure Time @ 70°C |
Hours |
0.5 |
|
CURED PROPERTIES (30 minutes @ 70°C) |
|
|
|
Appearance |
Gray |
|
|
Density (23°C) |
g/cm3 |
2.69 |
|
Hardness |
Shore E |
40 |
|
Thermal conductivity*3 |
W/mK |
1.6 |
|
Volume Resistivity |
MΩm/ (Ω.cm) |
4.0×106/ (4×1014) |
|
Dielectric strength |
kV/mm |
20 |
