TG-996-3 is an ultra-soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the heat from electronic devices, especially in integrated circuit (IC) and LED packaging.

FEATURES

• Low thermal impedance, good surface compliance, high dielectric breakdown voltage,
  very low hardness and elasticity, high thermal conductivity, good high temperature
  resistance and good electrical insulation.
• Wide range of formats ranging from custom
  die cut parts to standard sheets in a range of thicknesses depending on the end
  application.

APPLICATIONS

Soft silicone based thermal interface material or heat sink to dissipate the heat from
electronic devices, especially in integrated circuit (IC) devices and LED packaging.