TIS420C is a one-component thermally conductive Gap Filler and cures at room temperature to become a mechanically stable silicone gel. Due to its curing performance, TIS420C provides improved stability in 3- dimensional and vertical TIM applications that require a stress-absorbing, pump-out resistant, mechanically stable, and repairable heat path.

FEATURES:

• 1 component system
• High thermal conductivity
• Physical stability due to polymerization during cure
• Soft, stress-absorbing post-cure properties
• Conforms to intricate shapes & component designs
• Use within a broad operating temperature range
• Repairable

APPLICATIONS:

• Gap filler
• Thermally Conductive Management