TGNSP36K Non-Silicone Putty
https://prostech.ph/tgnsp36k-non-silicone-putty/
TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic
PC96 Non-Silicone Gap Filler
https://prostech.ph/pc96-non-silicone-gap-filler/
PC96 is a soft, non-silicone thermal interface pad. PC96 is designed to replace silicone pads when the application could not
BERGQUIST GAP FILLER TGF 3010APS
https://prostech.ph/bergquist-gap-filler-tgf-3010aps/
BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput