TG-X is high performance silicone gap filler with a thermal conductivity of 12 W/mk. TG-X is highly conformable and can

TG-NSP36K-1 is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic

TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic

TG-996-3 is an ultra-soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the

TG-996-1 is an ultra-soft, silicone based thermal gap filler which offers low thermal impedance, good surface compliance and a high

TG832 is an ultra-soft, silicone based thermal interface material. TG832 has a low thermal impedance, conforms readily to surfaces due

TG6050 is an ultra-soft, silicone based thermal interface material. TG6050 has a low thermal impedance, conforms readily to surfaces due

TG4040LC is an ultra-soft, silicone based thermal interface material which has one face naturally tacky and one face dry. TG4040LC

TG4040F is an ultra-soft, silicone based thermal interface material with an additional fiber glass layer for ease of handling. TG4040F

TG4040 is an ultra-soft, silicone based thermal interface material. TG4040 has a low thermal impedance, conforms readily to surfaces due

TG2030 is an ultra-soft, silicone based thermal interface material. TG2030 has a low thermal impedance, conforms readily to surfaces due

TG 937 is a white, highly filled silicone system suitable for screen printing process and thermal dissipation of electronic devices.