Product DescriptionKey Properties of Bectron® SK 75V1-35 / SH 79V2-35Application Areas of Bectron® SK 75V1-35 / SH 79V2-35 Product Description

Product DescriptionKey Properties of Bectron® SK 75V2-45 / SH 79V2-45Application of Bectron® SK 75V2-45 / SH 79V2-45 Product Description Bectron®

Product Description:Key Features of INSULCAST 8127:Ideal For: Product Description: INSULCAST 8127 is a flame-retardant, reversion-resistant silicone compound designed for superior

Product descriptionFeatures and Benefits of Bergquist TGF 3010APS Gap FillerApplications of Bergquist TGF 3010APS Gap Filler Product description Bergquist TGF

HumiSeal® TS 300 HumiSeal® TS 300 is a non-flammable, high-temperature temporary masking compound specifically formulated for use on printed circuit

INSULCAST 42 is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent

Bectron® SC 76V1-20 is a transparent conformal coating based on silicone chemistry. The product Bectron® SC 76V1-20 meets the latest

BERGQUIST® GAP PAD® TGP 2000SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material

BERGQUIST® GAP PAD® TGP 3004SF is a high-performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST® GAP PAD® TGP 3004SF

BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput

A thermally conductive, liquid gap filler material. Technology Silicone Appearance (cured) Pink Appearance – Part A Pink Appearance – Part

Thermally Conductive, Silicone-Free Gap Filling Material Technology Silicone free Appearance (cured) Orange Appearance – Part A Yellow Appearance – Part